XCVM1502-1MSINFVB1369 System On Chip (SoC)_Inntra Technology_Electronic Components_Integrated Circuits (IC)_Semiconductor Components_ A significant player in the global electronic components market.

XCVM1502-1MSINFVB1369

Product_Category

System On Chip (SoC)

Manufacturer

Xilinx (AMD)

Type

IC VERSALPRIME ACAP FPGA 1369BGA

Encapsulation

Packages

Tray

RoHS

YES

Price

$7,985.0000

Specifications

PDF(1)

TYPE	DESCRIPTION
Mfr	Xilinx (AMD)
Series	Versal™ Prime
Package	Tray
Product Status	ACTIVE
Package / Case	1369-BFBGA, FCBGA
Speed	600MHz, 1.3GHz
RAM Size	256KB
Number of I/O	478
Operating Temperature	-40°C ~ 110°C (TJ)
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes	Versal™ Prime FPGA, 1M Logic Cells
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DDR, DMA, PCIe
Supplier Device Package	1369-FCBGA (35x35)
Architecture	MPU, FPGA

$74.0900

$101.9000

$124.4000

$86.9000

$19,621.0600